Capsonic’s Engineering department develops new product concepts independently in support of developing customer markets. We also develop designs to meet customers’ applications specifications (or industry specifications). Designs are developed using 3D Solids Designs and computer simulation/analysis for dimensional stacks, thermal analysis, magnetic analysis, load/stress analysis, and assembly sequences. Prototypes can be produced to demonstrate the production-intent part appearance and function. Our fully equipped testing lab provides boundary performance data for design validation and alternative design content selection. Our engineering is done with a virtual engineering concept – individual, or small teams, are fully responsible for the design of the product and the core assembly system to produce the product in a volume setting. Our engineering group is fully interactive with our customers in order to provide the product that is optimal for the customers’ needs.

  • Solid Works 3D CAD
    • Integrated Motion Analysis
    • Integrated Mold Flow Analysis/Simulation
    • Integrated FEA for Mechanical Stress
    • Integrated FEA for Thermal Analysis
  • Ansys 3D magnetic simulation
  • Parametric Stack Analysis
  • On site test and validation lab
    • All Electromechanical Testing except EMC/RFI/BCI
    • HALT prepared
  • 4 Enviromental Chambers with data acquisition
  • TRICOR – High resolution force vs. displacement measurement
  • Prototype & Rapid Prototype capabilities
    • CNC Machining & Wire EDM
    • 3D FDM Printing